DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 607

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

17.4.3
Mode Transitions: When the mode pins and the FWE pin are set in the reset state and a reset-
start is executed, the chip enters one of the operating modes shown in figure 17.3. In user mode,
flash memory can be read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and programmer
mode.
Notes: Only make a transition between user mode and user program mode when the CPU is
FWE = 1,
SWE = 1
(on-chip ROM
User mode
enabled)
Flash Memory Operating Modes
not accessing the flash memory.
* MD2 = MD1 = MD0 = 0, PF2 = 1, PF1 = PF0 = 0
On-board programming mode
program mode
FWE = 0
or SWE = 0
User
Figure 17.3 Flash Memory Mode Transitions
MD1 = 1,
MD2 = 1,
FWE = 0
RES = 0
RES = 0
FWE = 1,
MD1 = 1,
MD2 = 0
Reset state
Boot mode
Rev.7.00 Feb. 14, 2007 page 573 of 1108
RES = 0
*
RES = 0
Programmer mode
REJ09B0089-0700
Section 17 ROM