DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 812

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

Section 17 ROM
User Boot MAT Blank Check
The boot program will check whether or not all user boot MATs are blank and return the result.
Command
• Command, H'4C, (1 byte): Blank check for user boot MAT
Response
• Response, H'06, (1 byte): Response to the blank check of user boot MAT
Error
Response
• Error Response, H'CC, (1 byte): Response to blank check for user boot MAT
• Error Code, H'52, (1 byte): Erasure has not been completed.
User MAT Blank Check
The boot program will check whether or not all user MATs are blank and return the result.
Command
• Command, H'4D, (1 byte): Blank check for user MATs
Response
• Response, H'06, (1 byte): Response to the blank check for user boot MATs
Error
Response
• Error Response, H'CD, (1 byte) : Error response to the blank check of user MATs.
• Error code
Rev.7.00 Feb. 14, 2007 page 778 of 1108
REJ09B0089-0700
If all user MATs are blank (H'FF), the boot program will return ACK.
If the contents of all user MATs are blank (H'FF), the boot program will return ACK.
H'4C
H'06
H'CC
H'4D
H'06
H'CD
H'52 (1 byte): Erasure has not been completed.
H'52
H'52