DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 543

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

13.3
13.3.1
The main functions of the smart card interface are as follows.
• One frame consists of 8-bit data plus a parity bit.
• In transmission, a guard time of at least 2 etu (1 etu in block transfer mode) (elementary time
• If a parity error is detected during reception, a low error signal level is output for one etu
• If the error signal is sampled during transmission, the same data is transmitted automatically
• Only asynchronous communication is supported; there is no synchronous communication
unit: the time for transfer of 1 bit) is left between the end of the parity bit and the start of the
next frame.
period, 10.5 etu after the start bit. (This does not apply to block transfer mode.)
after the elapse of 2 etu or longer. (This does not apply to block transfer mode.)
function.
Operation
Overview
Rev.7.00 Feb. 14, 2007 page 509 of 1108
Section 13 Smart Card Interface
REJ09B0089-0700