DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 516

MCU 3V 128K 100-TQFP

DF2317VTE25

Manufacturer Part Number
DF2317VTE25
Description
MCU 3V 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2317VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
79
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2317VTE25
HD64F2317VTE25

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Section 12 Serial Communication Interface (SCI)
Data Transfer Format
A fixed 8-bit data format is used.
No parity or multiprocessor bits are added.
Clock
Either an internal clock generated by the built-in baud rate generator or an external serial clock
input at the SCK pin can be selected, according to the setting of the C/A bit in SMR and the CKE1
and CKE0 bits in SCR. For details of SCI clock source selection, see table 12.9.
When the SCI is operated on an internal clock, the serial clock is output from the SCK pin.
Eight serial clock pulses are output in the transfer of one character, and when no transfer is
performed the clock is fixed high. When only receive operations are performed, however, the
serial clock is output until an overrun error occurs or the RE bit is cleared to 0. To perform receive
operations in units of one character, an external clock should be selected as the clock source.
Rev.7.00 Feb. 14, 2007 page 482 of 1108
REJ09B0089-0700

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