DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 545

MCU 3V 128K 100-TQFP

DF2317VTE25

Manufacturer Part Number
DF2317VTE25
Description
MCU 3V 128K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2317VTE25

Core Processor
H8S/2000
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
POR, PWM, WDT
Number Of I /o
79
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.7 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2317VTE25
HD64F2317VTE25

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13.3.3
Normal Transfer Mode: Figure 13.3 shows the smart card interface data format in the normal
transfer mode. In reception in this mode, a parity check is carried out on each frame. If an error is
detected an error signal is sent back to the transmitting end, and retransmission of the data is
requested. If an error signal is sampled during transmission, the same data is retransmitted.
Legend:
Ds:
D0 to D7: Data bits
Dp:
DE:
When there is no parity error
When a parity error occurs
Data Format
Start bit
Parity bit
Error signal
Ds
Ds
D0
D0
Figure 13.3 Smart Card Interface Data Format
D1
D1
D2
D2
Transmitting station output
Transmitting station output
D3
D3
D4
D4
D5
D5
Rev.7.00 Feb. 14, 2007 page 511 of 1108
D6
D6
Section 13 Smart Card Interface
D7
D7
Dp
Dp
Receiving station
output
REJ09B0089-0700
DE

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