DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 603

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

Notes: 1. Note that in modes 6, 7, 14, and 15, the on-chip ROM that can be used after a reset is
2. Note that in the mode 10 and mode 11 boot modes, the on-chip ROM that can be used
3. Apart from the fact that flash memory can be erased and programmed, operation is the
4. Apart from the fact that flash memory can be erased and programmed, operation is the
5. The capacity of on-chip ROM in the H8S/2318 F-ZTAT is 256 kbytes.
the 64-kbyte area from H'000000 to H'00FFFF.
immediately after all flash memory is erased by the boot program is the 64-kbyte area
from H'000000 to H'00FFFF.
same as in advanced expanded mode with on-chip ROM enabled.
same as in advanced single-chip mode.
The capacity of on-chip ROM in the H8S/2317 F-ZTAT is 128 kbytes.
The capacity of on-chip ROM in the H8S/2315 F-ZTAT and H8S/2314 F-ZTAT is
384 kbytes.
Rev.7.00 Feb. 14, 2007 page 569 of 1108
REJ09B0089-0700
Section 17 ROM