DF2317VTE25 Renesas Electronics America, DF2317VTE25 Datasheet - Page 781

• Manufacturer Part Number: DF2317VTE25
• Description: MCU 3V 128K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2317VTE25

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: POR, PWM, WDT
• Number Of I /o: 79
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.7 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2317VTE25; HD64F2317VTE25

17.28.1 Pin Arrangement of the Socket Adapter
Attach the socket adapter to the LSI in the way shown in figure 17.81. This allows conversion to
40 pins. Figure 17.80 shows the memory mapping of the on-chip ROM, and figure 17.81 shows
the arrangement of the socket adapter's pins.
Address in
MCU mode
H'07FFFF
H'000000
On-chip ROM space
(user MAT)
512 kbytes
Figure 17.80 Mapping of On-Chip Flash Memory
Address in
PROM mode
H'00000
H'7FFFF
Address in
MCU mode
H'000000
H'001FFF
Rev.7.00 Feb. 14, 2007 page 747 of 1108
On-chip ROM space
(user boot MAT)
8 kbytes
REJ09B0089-0700
Section 17 ROM
Address in
PROM mode
H'00000
H'01FFF