QG82945GSE S LB2R Intel, QG82945GSE S LB2R Datasheet - Page 390

• Manufacturer Part Number: QG82945GSE S LB2R
• Description: GRAPHICS AND MEM CNTRL HUB; No. of Pins: 998; Package / Case: FCBGA; Interface Type: PCI, SATA, USB
• Manufacturer: Intel

10.7
10.7.1
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Thermal Management
System level thermal management requires comprehending thermal solutions for two
domains of operation:
This chapter covers the thermal failsafe assistance mechanisms that are available for
the (G)MCH and recommends a usage model designed to accomplish the failsafe
Protection Assistance.
The Mobile Intel 945GM/GME/PM/GMS/GU/GSE, 943/940GML and Intel 945GT Express
Chipsets provide two internal thermal sensors, plus hooks for an external thermal
sensor mechanism. These can be used for detecting the component temperature and
for triggering thermal control within the (G)MCH. The (G)MCH has implemented several
silicon level thermal management features that can lower both (G)MCH and DDR power
during periods of high activity. These features can help control temperature of the
(G)MCH and DDR and thus help prevent thermally induced component failures. These
features include:
Internal Thermal Sensor
The Mobile Intel 945GM/GME/PM/GMS/GU/GSE, 943/940GML and Intel 945GT Express
Chipsets incorporate two on-die thermal sensors for thermal management.
When “tripped” at various values, the thermal sensors may be programmed to cause
hardware throttling and/or software interrupts. Hardware throttling includes main
memory programmable throttling thresholds. Sensor trip points may also be
programmed to be generated various interrupts, including SCI, SMI, SERR, or an
internal graphics INTR.
1. Robust Thermal Solution Design: Proper system design should include
2. Thermal Failsafe Protection Assistance: As a backup to the implemented thermal
• Memory throttling triggering by memory heating
• Memory throttling triggering by (G)MCH heating
• THRMTRIP# support
implementation of a robust thermal solution. The system’s thermal solution should
be capable of dissipating the platform’s TDP power while keeping all components
(particularly (G)MCH, for the purposes of this discussion) below the relevant
Tdie_max under the intended usage conditions. Such conditions include ambient air
temperature and available airflow inside the notebook.
solution, the system design should provide a method to provide additional thermal
protection for the components of concern (particularly (G)MCH, for purposes of this
discussion). The failsafe assistance mechanism is to help manage components from
being damaged by excessive thermal stress under situations in which the
implemented thermal solution is inadequate or has failed.
Functional Description
Datasheet