AT91RM9200-QI-002 Atmel, AT91RM9200-QI-002 Datasheet - Page 665

IC ARM9 MCU 208 PQFP

AT91RM9200-QI-002

Manufacturer Part Number
AT91RM9200-QI-002
Description
IC ARM9 MCU 208 PQFP
Manufacturer
Atmel
Series
AT91SAMr

Specifications of AT91RM9200-QI-002

Core Processor
ARM9
Core Size
16/32-Bit
Speed
180MHz
Connectivity
EBI/EMI, Ethernet, I²C, MMC, SPI, SSC, UART/USART, USB
Peripherals
POR
Number Of I /o
122
Program Memory Size
128KB (128K x 8)
Program Memory Type
ROM
Ram Size
48K x 8
Voltage - Supply (vcc/vdd)
1.65 V ~ 1.95 V
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-MQFP, 208-PQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AT91RM9200-QI-002
Manufacturer:
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Quantity:
10 000
Part Number:
AT91RM9200-QI-002 SL383
Manufacturer:
Atmel
Quantity:
10 000
39.3
39.3.1
1768I–ATARM–09-Jul-09
Soldering Profiles
Standard Packages
Table 39-10
Table 39-10. Soldering Profile
Small packages may be subject to higher temperatures if they are reflowed in boards with larger
components. In this case, small packages may have to withstand temperatures of up to 235⋅ C,
not 220⋅ C (IR reflow).
Recommended package reflow conditions depend on package thickness and volume. See
Table
Table 39-11. Recommended Package Reflow Conditions (LQFP and BGA)
Notes:
A maximum of three reflow passes is allowed per component.
Average Ramp-up Rate (183⋅ C to Peak)
Preheat Temperature 125⋅ C ±25⋅ C
Temperature Maintained Above 183⋅ C
Time within 5⋅ C of Actual Peak Temperature
Peak Temperature Range
Ramp-down Rate
Time 25⋅ C to Peak Temperature
Parameter
Convection
VPR
IR/Convection
39-11.
1. The packages are qualified by Atmel by using IR reflow conditions, not convection or VPR.
2. By default, the package level 1 is qualified at 220⋅ C (unless 235⋅ C is stipulated).
3. The body temperature is the most important parameter but other profile parameters such as
total exposure time to hot temperature or heating rate may also influence component reliability.
gives the recommended soldering profile from J-STD-20.
Convection or
IR/Convection
3⋅ C/sec. max.
120 sec. max
60 sec. to 150 sec.
10 sec. to 20 sec.
220 +5/-0⋅ C or
235 +5/-0⋅ C
6⋅ C/sec.
6 min. max
Temperature
220 +5/-0⋅ C
215 to 219⋅ C
220 +5/-0⋅ C
VPR
10⋅ C/sec.
60 sec.
215 to 219⋅ C or
235 +5/-0⋅ C
10⋅ C/sec.
AT91RM9200
(1) (2)(3)
665

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