R5F61662N50FPV Renesas Electronics America, R5F61662N50FPV Datasheet - Page 28

• Manufacturer Part Number: R5F61662N50FPV
• Description: MCU 24KB FLASH 384K 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of R5F61662N50FPV

• Core Processor: H8SX
• Core Size: 16/32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 92
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

24.8
24.9
24.10 Sleep Instruction Exception Handling .............................................................................. 921
24.11 Bφ Clock Output Control.................................................................................................. 924
24.12 Usage Notes ...................................................................................................................... 925
Section 25 List of Registers............................................................................... 927
25.1
25.2
25.3
Section 26 Electrical Characteristics ................................................................. 973
26.1
26.2
Rev. 2.00 Sep. 16, 2009 Page xxvi of xxviii
Deep Software Standby Mode .......................................................................................... 908
24.8.1
24.8.2
24.8.3
24.8.4
24.8.5
24.8.6
24.8.7
Hardware Standby Mode .................................................................................................. 919
24.9.1
24.9.2
24.9.3
24.9.4
24.12.1 I/O Port Status................................................................................................... 925
24.12.2 Current Consumption during Oscillation Settling Standby Period ................... 925
24.12.3 Module Stop State of DMAC or DTC .............................................................. 925
24.12.4 On-Chip Peripheral Module Interrupts ............................................................. 925
24.12.5 Writing to MSTPCRA, MSTPCRB, and MSTPCRC....................................... 925
24.12.6 Control of Input Buffers by DIRQnE (n = 3 to 0)............................................. 926
24.12.7 Input Buffer Control by DIRQnE (n = 3 to 0) .................................................. 926
24.12.8 Bφ Output State ................................................................................................ 926
Register Addresses (Address Order)................................................................................. 928
Register Bits ..................................................................................................................... 941
Register States in Each Operating Mode .......................................................................... 960
Electrical Characteristics .................................................................................................. 973
26.1.1
26.1.2
26.1.3
26.1.4
26.1.5
26.1.6
Timing Charts ................................................................................................................... 992
Setting Oscillation Settling Time after Exit from
Deep Software Standby Mode .......................................................................... 911
Entry to Deep Software Standby Mode ............................................................ 908
Exit from Deep Software Standby Mode.......................................................... 909
Pin State on Exit from Deep Software Standby Mode...................................... 910
Bφ Operation after Exit from Deep Software Standby Mode ........................... 910
Deep Software Standby Mode Application Example ....................................... 913
Flowchart of Deep Software Standby Mode Operation .................................... 917
Transition to Hardware Standby Mode............................................................. 919
Clearing Hardware Standby Mode.................................................................... 919
Hardware Standby Mode Timing...................................................................... 919
Timing Sequence at Power-On ......................................................................... 920
Absolute Maximum Ratings ............................................................................. 973
DC Characteristics ............................................................................................ 974
AC Characteristics ............................................................................................ 979
A/D Conversion Characteristics ....................................................................... 986
D/A Conversion Characteristics ....................................................................... 986
∆ΣA/D Conversion Characteristics................................................................... 987