R5F61662N50FPV Renesas Electronics America, R5F61662N50FPV Datasheet - Page 26

• Manufacturer Part Number: R5F61662N50FPV
• Description: MCU 24KB FLASH 384K 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of R5F61662N50FPV

• Core Processor: H8SX
• Core Size: 16/32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 92
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 20 D/A Converter ................................................................................. 769
20.1
20.2
20.3
20.4
20.5
Section 21 RAM ................................................................................................ 775
Section 22 Flash Memory.................................................................................. 777
22.1
22.2
22.3
22.4
22.5
22.6
22.7
22.8
22.9
22.10 Flash Memory Emulation Using RAM............................................................................. 833
22.11 Switching between User MAT and User Boot MAT........................................................ 836
22.12 Programmer Mode ............................................................................................................ 837
22.13 Standard Serial Communication Interface Specifications for Boot Mode ........................ 837
22.14 Usage Notes ...................................................................................................................... 866
Rev. 2.00 Sep. 16, 2009 Page xxiv of xxviii
19.6.5
Features............................................................................................................................. 769
Input/Output Pins.............................................................................................................. 770
Register Descriptions........................................................................................................ 770
20.3.1
20.3.2
Operation .......................................................................................................................... 773
Usage Notes ...................................................................................................................... 774
20.5.1
20.5.2
Features............................................................................................................................. 777
Mode Transition Diagram................................................................................................. 779
Memory MAT Configuration ........................................................................................... 781
Block Structure ................................................................................................................. 782
Programming/Erasing Interface ........................................................................................ 783
Input/Output Pins.............................................................................................................. 785
Register Descriptions........................................................................................................ 785
22.7.1
22.7.2
22.7.3
On-Board Programming Mode ......................................................................................... 806
22.8.1
22.8.2
22.8.3
22.8.4
Protection.......................................................................................................................... 830
22.9.1
22.9.2
22.9.3
DSE Bit............................................................................................................. 768
D/A Data Registers 0 and 1 (DADR0 and DADR1)......................................... 770
D/A Control Register 01 (DACR01) ................................................................ 771
Module Stop Function Setting .......................................................................... 774
D/A Output Hold Function in Software Standby Mode.................................... 774
Programming/Erasing Interface Registers ........................................................ 786
Programming/Erasing Interface Parameters ..................................................... 793
RAM Emulation Register (RAMER)................................................................ 805
Boot Mode ........................................................................................................ 806
User Program Mode.......................................................................................... 810
User Boot Mode................................................................................................ 820
On-Chip Program and Storable Area for Program Data ................................... 824
Hardware Protection ......................................................................................... 830
Software Protection........................................................................................... 831
Error Protection ................................................................................................ 831