R5F61662N50FPV Renesas Electronics America, R5F61662N50FPV Datasheet - Page 1013

• Manufacturer Part Number: R5F61662N50FPV
• Description: MCU 24KB FLASH 384K 144-LQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of R5F61662N50FPV

• Core Processor: H8SX
• Core Size: 16/32-Bit
• Speed: 50MHz
• Connectivity: EBI/EMI, I²C, IrDA, SCI, SmartCard, USB
• Peripherals: DMA, LVD, POR, PWM, WDT
• Number Of I /o: 92
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 40K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 144-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Item
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
BS delay time
RD/WR delay time
(4)
Table 26.7 DMAC Timing
Conditions: Vcc = PLLVcc = 3.0 to 3.6 V, AVcc = 3.0 to 3.6 V, AVccP = AVccA = AVccD = 3.0
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
DMAC Timing
to 3.6 V, Vref = 3.0 V to AVcc, AVrefT = AVccA, Vss = PLLVss = AVss = AVssP =
AVssA = AVssD = AVrefB = 0 V
Bφ = 8 to 50 MHz, Ta = –20 to + 75 °C (regular specifications),
Ta = –40 to + 85 °C (wide-range specifications)
Symbol
t
t
t
t
t
t
t
t
Symbol
t
t
t
t
t
WTS
WTH
BREQS
BACD
BZD
BRQOD
BSD
RWD
DRQS
DRQH
TED
DACD1
DACD2
Min.
15
5.0
20



1.0

Min.
20
5
—
—
—
Max.



15
30
15
15
15
Max.
—
—
20
20
20
Rev. 2.00 Sep. 16, 2009 Page 983 of 1036
Section 26 Electrical Characteristics
Unit
ns
ns
ns
ns
ns
ns
ns
ns
Unit
ns
ns
ns
ns
ns
Test
Conditions
Figures 26.11,
26.19
Figure 26.20
Figure 26.21
Figures 26.9,
26.10, 26.12 to
26.15
REJ09B0414-0200
Test
Conditions
Figure 26.22
Figures 26.24,
26.25
Figure 26.23