TMPM370FYFG Toshiba, TMPM370FYFG Datasheet - Page 490
TMPM370FYFG
Manufacturer Part Number
TMPM370FYFG
Description
Manufacturer
Toshiba
Datasheet
1.TMPM370FYFG.pdf
(498 pages)
Specifications of TMPM370FYFG
Product Summaries
Summary
Lead Free
Yes
Rohs Compatible Product(s)
Available
Rom (kbytes)
256K
Rom Type
Flash
Ram (kbytes)
10K
Number Of Pins
100
Package
LQFP(14x14)
Vcc
5V
Cpu Mhz
80
Ssp (ch) Spi
-
I2c/sio (ch)
-
Uart/sio (ch)
4
Usb
-
Can
-
Ethernet
-
External Bus Interface
N
Cs/wait Controller (ch)
-
Dma Controller
-
10-bit Da Converter
-
10-bit Ad Converter
-
12-bit Ad Converter
27
16-bit Timer / Counter
8
Motor / Igbt Control
Vector Engine
Real Time Clock
-
Watchdog Timer
Y
Osc Freq Detect
Y
Clock Gear
Y
Low-power Hold Function
-
Remote Control Interface
-
Hardware Cec Controller
-
Comparators
4
Low-voltage Detector
Y
Etm Hardware Trace
2-bit
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
TMPM370FYFG
Manufacturer:
TOSHIBA
Quantity:
1 000
Part Number:
TMPM370FYFG
Manufacturer:
TOSHIBA/东芝
Quantity:
20 000
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24.9 Oscillation Circuit
24.10 Handling Precaution
Solderability
Solderability
parameter
Note1: The load value of the oscillator is the sum of loads (C1 and C2) and the floating load of the
Note2: Do not be driven X1/X2 by external driver.
Test
selecting external parts.
The TMPM370 has been evaluated by the oscillator vender below. Use this information when
The TMPM370 recommends the high-frequency oscillator by Murata Manufacturing Co., Ltd.
Please refer to the following URL for details.
http://www.murata.co.jp
(1) Connection example
(2) Recommended ceramic oscillator
actual assembled board. There is a possibility of operating error when using C1 and C2
values in the table below. When designing the board, design the minimum length pattern
around the oscillator. We also recommend that oscillator evaluation be carried out using
the actual board.
Use of Sn-37Pb solder Bath
Solder bath temperature = 230°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Use of Sn-3.0Ag-0.5Cu solder bath
Solder bath temperature = 245°C, Dipping time = 5 seconds
The number of times = one, Use of R-type flux
Fig 24-4 High-frequency oscillation connection
Test condition
C1
X1
TMPM370 24-9
C2
X2
Rd
Pass:
solderability rate until forming ≧ 95%
Electrical Characteristics
Note
TMPM370
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