EP1S40B956C5 Altera, EP1S40B956C5 Datasheet - Page 459
EP1S40B956C5
Manufacturer Part Number
EP1S40B956C5
Description
IC STRATIX FPGA 40K LE 956-BGA
Manufacturer
Altera
Series
Stratix®r
Datasheet
1.EP1S10F484I6N.pdf
(864 pages)
Specifications of EP1S40B956C5
Number Of Logic Elements/cells
41250
Number Of Labs/clbs
4125
Total Ram Bits
3423744
Number Of I /o
683
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
956-BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Number Of Gates
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
EP1S40B956C5
Manufacturer:
ALTERA/阿尔特拉
Quantity:
20 000
- Current page: 459 of 864
- Download datasheet (11Mb)
Altera Corporation
June 2006
■
■
Figure 4–21. Legal Pin Placement
Note to
(1)
VREF Pad Placement Guidelines
Restrictions on the placement of single-ended voltage-referenced I/O
pads with respect to VREF pads help maintain an acceptable noise level
on the V
the VREF rail. The following guidelines are for placing single-ended pads
in Stratix devices.
Input Pins
Each VREF pad supports a maximum of 40 input pads with up to 20 on
each side of the VREF pad.
Output Pins
When a voltage referenced input or bidirectional pad does not exist in a
bank, there is no limit to the number of output pads that can be
implemented in that bank. When a voltage referenced input exists, each
VREF pad supports 20 outputs for thermally enhanced FineLine BGA
and thermally enhanced BGA cavity up packages or 15 outputs for Non-
thermally enhanced cavity up and non-thermally enhanced
FineLine BGA packages.
For flip-chip packages, there are no restrictions for placement of
single-ended input signals with respect to differential signals (see
Figure
only be placed four or more pads away from a differential pad.
Single-ended outputs and bidirectional pads may only be placed five
or more pads away from a differential pad (see
regardless of package type.
Input pads on a flip-chip packages have no restrictions.
Input, Output,
Bidirectional
Figure
CCIO
4–21). For wire-bond packages, single ended input pads may
Wirebond
supply and to prevent output switching noise from shifting
4–21:
Input
Selectable I/O Standards in Stratix & Stratix GX Devices
FlipChip
Input
Differential Pin
Note (1)
Stratix Device Handbook, Volume 2
Figure
Input
Input, Output,
Bidirectional
4–21),
4–31
®
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