SAM9RL64 Atmel Corporation, SAM9RL64 Datasheet - Page 876

• Manufacturer Part Number: SAM9RL64
• Manufacturer: Atmel Corporation

Specifications of SAM9RL64

• Flash (kbytes): 0 Kbytes
• Pin Count: 217
• Max. Operating Frequency: 240 MHz
• Cpu: ARM926
• Hardware Qtouch Acquisition: No
• Max I/o Pins: 118
• Ext Interrupts: 118
• Usb Transceiver: 1
• Usb Speed: Hi-Speed
• Usb Interface: Device
• Spi: 1
• Twi (i2c): 2
• Uart: 5
• Ssc: 2
• Sd / Emmc: 1
• Graphic Lcd: Yes
• Video Decoder: No
• Camera Interface: No
• Adc Channels: 6
• Adc Resolution (bits): 10
• Adc Speed (ksps): 220
• Resistive Touch Screen: Yes
• Temp. Sensor: No
• Crypto Engine: No
• Sram (kbytes): 64
• Self Program Memory: NO
• External Bus Interface: 1
• Dram Memory: sdram
• Nand Interface: Yes
• Picopower: No
• Temp. Range (deg C): -40 to 85
• I/o Supply Class: 1.8/3.3
• Operating Voltage (vcc): 1.08 to 1.32
• Fpu: No
• Mpu / Mmu: No / Yes
• Timers: 3
• Output Compare Channels: 3
• Input Capture Channels: 3
• Pwm Channels: 4
• 32khz Rtc: Yes
• Calibrated Rc Oscillator: No

45. AT91SAM9R64/RL64 Mechanical Characteristics
45.1
Figure 45-1. 144-ball BGA Package Drawing
Table 45-1.
Table 45-2.
Table 45-3.
Table 45-4.
This package respects the recommendations of the NEMI User Group.
876
Ball Land
Soldering Mask Opening
300
Moisture Sensitivity Level
JEDEC Drawing Reference
JESD97 Classification
Package Drawings
AT91SAM9R64/RL64
Soldering Information (Substrate Level)
Device and 144-ball BGA Package Maximum Weight
144-ball BGA Package Characteristics
Package Reference
mg
0.380 mm
0.280 mm
3
none
e1
6289D–ATARM–3-Oct-11