DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 995

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

(4) DMAC Timing
Table 25.34 DMAC Timing
Conditions: V
Item
Precharge time 1
Precharge time 2
Self-refresh precharge time 1
Self-refresh precharge time 2
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
φ = 8 MHz to 34 MHz, T
T
a
CC
= −40°C to +85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
Symbol
t
t
t
t
t
t
t
t
t
t
PCH1
PCH2
RPS1
RPS2
WTS
WTH
BREQS
BACD
BZD
BRQOD
a
CC
= −20°C to +75°C (regular specifications),
= 3.0 V to 3.6 V, V
Min.
25
10
⎯
⎯
⎯
Min.
1.0 × t
1.5 × t
2.5 × t
3.0 × t
25
5
30
⎯
⎯
⎯
cyc
cyc
cyc
cyc
−20
−20
−20
−20
Max.
⎯
⎯
18
18
18
Rev.6.00 Mar. 18, 2009 Page 935 of 980
Max.
⎯
⎯
⎯
⎯
⎯
⎯
⎯
15
40
25
ref
Section 25 Electrical Characteristics
= 3.0 V to AV
Unit
ns
ns
Test Conditions
Figure 25.27
Figure 25.26
Figures 25.24 and 25.25
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CC
, V
REJ09B0050-0600
SS
Test Conditions
Figures 25.6 to
25.19
Figures 25.20 and
25.21
Figures 25.14
Figure 25.22
Figure 25.23
= AV
SS
= 0 V,