DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 37

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Section 18 RAM
Section 19 Flash Memory (0.35-μm F-ZTAT Version)
19.1 Features ............................................................................................................................. 689
19.2 Mode Transitions .............................................................................................................. 691
19.3 Block Configuration.......................................................................................................... 695
19.4 Input/Output Pins .............................................................................................................. 697
19.5 Register Descriptions ........................................................................................................ 697
19.6 On-Board Programming Modes ........................................................................................ 702
19.7 Flash Memory Programming/Erasing ............................................................................... 706
19.8 Program/Erase Protection.................................................................................................. 710
19.9 Programmer Mode ............................................................................................................ 711
19.10 Power-Down States for Flash Memory............................................................................. 711
19.11 Usage Notes ...................................................................................................................... 712
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
20.1 Features ............................................................................................................................. 717
20.2 Input/Output Pins .............................................................................................................. 726
20.3 Register Descriptions ........................................................................................................ 726
17.5.1 Setting for Module Stop Mode............................................................................. 686
17.5.2 D/A Output Hold Function in Software Standby Mode....................................... 686
19.5.1 Flash Memory Control Register 1 (FLMCR1)..................................................... 698
19.5.2 Flash Memory Control Register 2 (FLMCR2)..................................................... 699
19.5.3 Erase Block Register 1 (EBR1) ........................................................................... 700
19.5.4 Erase Block Register 2 (EBR2) ........................................................................... 700
19.6.1 Boot Mode ........................................................................................................... 702
19.6.2 User Program Mode............................................................................................. 705
19.7.1 Program/Program-Verify ..................................................................................... 706
19.7.2 Erase/Erase-Verify............................................................................................... 708
19.7.3 Interrupt Handling when Programming/Erasing Flash Memory.......................... 708
19.8.1 Hardware Protection ............................................................................................ 710
19.8.2 Software Protection.............................................................................................. 710
19.8.3 Error Protection.................................................................................................... 710
20.1.1 Operating Mode ................................................................................................... 720
20.1.2 Mode Comparison................................................................................................ 721
20.1.3 Flash MAT Configuration.................................................................................... 722
20.1.4 Block Division ..................................................................................................... 723
20.1.5 Programming/Erasing Interface ........................................................................... 724
20.3.1 Programming/Erasing Interface Register ............................................................. 728
.................................................................................................................. 687
Rev.6.00 Mar. 18, 2009 Page xxxv of lviii
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REJ09B0050-0600