DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 1030

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Appendix
Rev.6.00 Mar. 18, 2009 Page 970 of 980
REJ09B0050-0600
Instruction
ROTXL.W
#2,Rd
ROTXL.L ERd R:W
ROTXL.L
#2,ERd
ROTXR.B Rd R:W
ROTXR.B
#2,Rd
ROTXR.W Rd R:W
ROTXR.W
#2,Rd
ROTXR.L ERd R:W
ROTXR.L
#2,ERd
RTE
RTS
SHAL.B Rd
SHAL.B #2,Rd R:W
SHAL.W Rd
SHAL.W
#2,Rd
SHAL.L ERd
SHAL.L
#2,ERd
SHAR.B Rd
Advanced
1
R:W
NEXT
NEXT
R:W
NEXT
NEXT
R:W
NEXT
NEXT
R:W
NEXT
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
R:W
NEXT
2
R:W
Stack
(EXR)
R:W:M
Stack
(H)
3
R:W
Stack
(H)
R:W
Stack (L)
4
R:W
Stack (L)
1 state of
internal
operation
5
1 state of
internal
operation
R:W *
3
6
R:W *
3
7
8
9