DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 832

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Part Number
Manufacturer
Quantity
Price
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Manufacturer:
Renesas Electronics America
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Manufacturer:
Renesas Electronics America
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Section 20 Flash Memory (0.18-μm F-ZTAT Version)
Table 20.8 (2)
Rev.6.00 Mar. 18, 2009 Page 772 of 980
REJ09B0050-0600
Item
Operation for
Selection of On-chip
Program to be
Downloaded
Operation for Writing
H'A5 to FKEY
Execution of Writing
SC0 = 1 to FCCS
(Download)
Operation for FKEY
Clear
Determination of
Download Result
Operation for
Download Error
Operation for Settings
of Initial Parameter
Execution of
Initialization
Determination of
Initialization Result
Operation for
Initialization Error
NMI Handling Routine
Operation for Inhibit
of Interrupt
Operation for Writing
H'5A to FKEY
Operation for Settings
of Erasure Parameter
Execution of Erasure
Determination of
Erasure Result
Useable Area for Erasure in User Program Mode
Storable /Executable Area
On-chip
RAM
User
MAT
×
×
×
×
×
×
External Space
(Expanded
Mode)
×
×
×
Selected MAT
User
MAT
Embedded
Program
Storage Area

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