DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 835

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
135
Part Number:
DF2367VF33V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Part Number:
DF2367VF33WV
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Notes: 1. Transferring the data to the on-chip RAM enables this area to be used.
Item
Operation for
Writing H'5A to
FKEY
Operation for
Settings of Program
Parameter
Execution of
Programming
Determination of
Program Result
Operation for
Program Error
Operation for FKEY
Clear
Switching MATs by
FMATS
2. Switching FMATS by a program in the on-chip RAM enables this area to be used.
Storable/Executable Area
On-chip
RAM
User
Boot
MAT
× *
×
×
×
×
×
×
2
Section 20 Flash Memory (0.18-μm F-ZTAT Version)
External Space
(Expanded
Mode)
×
×
Rev.6.00 Mar. 18, 2009 Page 775 of 980
Selected MAT
User
MAT
User
Boot
MAT
REJ09B0050-0600
Embedded
Program
Storage Area

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