DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 980

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Section 25 Electrical Characteristics
Item
Precharge time 1
Precharge time 2
Self-refresh precharge time 1
Self-refresh precharge time 2
WAIT setup time
WAIT hold time
BREQ setup time
BACK delay time
Bus floating time
BREQO delay time
Table 25.21 DMAC Timing
Conditions: V
Item
DREQ setup time
DREQ hold time
TEND delay time
DACK delay time 1
DACK delay time 2
Rev.6.00 Mar. 18, 2009 Page 920 of 980
REJ09B0050-0600
Table 0.•
DMAC Timing
φ = 8 MHz to 33 MHz, T
T
a
CC
= –40°C to +85°C (wide-range specifications)
= 3.0 V to 3.6 V, AV
Symbol
t
t
t
t
t
DRQS
DRQH
TED
DACD1
DACD2
Symbol
t
t
t
t
t
t
t
t
t
t
PCH1
PCH2
RPS1
RPS2
WTS
WTH
BREQS
BACD
BZD
BRQOD
a
CC
= –20°C to +75°C (regular specifications),
= 3.0 V to 3.6 V, V
Min
25
10
—
—
—
Min
1.0 × t
1.5 × t
2.5 × t
3.0 × t
25
5
30
—
—
—
cyc
cyc
cyc
cyc
–20
–20
–20
–20
Max
—
—
18
18
18
Max
—
—
—
—
—
—
—
15
40
25
ref
= 3.0 V to AV
Unit
ns
ns
Test Conditions
Figure 25.27
Figure 25.26
Figures 25.24 and 25.25
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
CC
, V
SS
Test Conditions
Figures 25.6 to
25.19
Figures 25.20 and
25.21
Figure 25.14
Figure 25.22
Figure 25.23
= AV
SS
= 0 V,