DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 1020

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Appendix
Rev.6.00 Mar. 18, 2009 Page 960 of 980
REJ09B0050-0600
Instruction
BOR
#xx:3,@ERd
BOR
#xx:3,@aa:8
BOR
#xx:3,@aa:16
BOR
#xx:3,@aa:32
BSET
#xx:3,Rd
BSET
#xx:3,@ERd
BSET
#xx:3,@aa:8
BSET
#xx:3,@aa:16
BSET
#xx:3,@aa:32
BSET Rn,Rd
BSET
Rn,@ERd
BSET
Rn,@aa:8
BSET
Rn,@aa:16
BSET
Rn,@aa:32
BSR
d:8
BSR
d:16
BST #xx:3,Rd R:W
BST
#xx:3,@ERd
Advanced
Advanced
1
R:W 2nd R:B EA R:W
R:W 2nd R:B EA R:W
R:W 2nd R:W 3rd R:B EA R:W
R:W 2nd R:W 3rd R:W 4th R:B EA R:W
R:W
NEXT
R:W 2nd R:B:M
R:W 2nd R:B:M
R:W 2nd R:W 3rd R:B:M
R:W 2nd R:W 3rd R:W 4th R:B:M
R:W
NEXT
R:W 2nd R:B:M
R:W 2nd R:B:M
R:W 2nd R:W 3rd R:B:M
R:W 2nd R:W 3rd R:W 4th R:B:M
R:W
NEXT
R:W 2nd
NEXT
R:W 2nd R:B:M
2
EA
EA
EA
EA
R:W EA W:W:M
1 state of
internal
operation
EA
3
NEXT
NEXT
R:W:M
NEXT
R:W:M
NEXT
EA
R:W:M
NEXT
R:W:M
NEXT
EA
Stack
(H)
R:W EA W:W:M
R:W:M
NEXT
4
NEXT
W:B EA
W:B EA
R:W:M
NEXT
EA
W:B EA
W:B EA
R:W:M
NEXT
EA
W:W
Stack (L)
Stack
(H)
W:B EA
NEXT
W:B EA
R:W:M
NEXT
W:B EA
5
R:W:M
NEXT
W:W
Stack (L)
W:B EA
6
W:B EA
7
8
9