DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 1025

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Instruction
LDMAC
ERs,MACL
MAC
@ERn+,@ER
m+
MOV.B
#xx:8,Rd
MOV.B Rs,Rd R:W
MOV.B
@ERs,Rd
MOV.B
@(d:16,ERs),
Rd
MOV.B
@(d:32,ERs),
Rd
MOV.B
@ERs+,Rd
MOV.B
@aa:8,Rd
MOV.B
@aa:16,Rd
MOV.B
@aa:32,Rd
MOV.B
Rs,@ERd
MOV.B Rs,
@(d:16,ERd)
MOV.B Rs,
@(d:32,ERd)
MOV.B Rs, @-
ERd
MOV.B
Rs,@aa:8
1
R:W
NEXT
R:W 2nd R:W
R:W
NEXT
NEXT
R:W
NEXT
R:W 2nd R:W
R:W 2nd R:W 3rd R:W 4th R:W
R:W
NEXT
R:W
NEXT
R:W 2nd R:W
R:W 2nd R:W 3rd R:W
R:W
NEXT
R:W 2nd R:W
R:W 2nd R:W 3rd R:W 4th R:W
R:W
NEXT
R:W
NEXT
2
1 state of
internal
operation
NEXT
R:B EA
NEXT
1 state of
internal
operation
R:B EA
NEXT
W:B EA
NEXT
1 state of
internal
operation
W:B EA
3
R:W
EAn
R:B EA
R:B EA
R:B EA
NEXT
W:B EA
W:B EA
4
R:W
EAm
NEXT
R:B EA
NEXT
5
R:B EA
W:B EA
Rev.6.00 Mar. 18, 2009 Page 965 of 980
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REJ09B0050-0600
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Appendix
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