DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 685

MCU 3V 384K 128-QFP

DF2367VF33

Manufacturer Part Number
DF2367VF33
Description
MCU 3V 384K 128-QFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2300r
Datasheet

Specifications of DF2367VF33

Core Processor
H8S/2000
Core Size
16-Bit
Speed
33MHz
Connectivity
I²C, IrDA, SCI, SmartCard
Peripherals
DMA, POR, PWM, WDT
Number Of I /o
84
Program Memory Size
384KB (384K x 8)
Program Memory Type
FLASH
Ram Size
24K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 10x10b, D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
128-QFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Other names
HD64F2367VF33
HD64F2367VF33

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Manufacturer:
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Figure 14.39 shows a sample flowchart for mode transition during reception.
Read TEND flag in SSR
<Start of transmission>
Transition to software
Figure 14.36 Sample Flowchart for Mode Transition during Transmission
Exit from software
operating mode?
<Transmission>
standby mode
standby mode
Yes
Yes
Yes
transmitted?
Initialization
TEND = 1
Change
All data
TE = 0
No
No
No
[1]
[2]
[3]
Section 14 Serial Communication Interface (SCI, IrDA)
TE = 1
[1] Data being transmitted is interrupted.
[2] If TIE and TEIE are set to 1, clear
[3] Includes module stop mode.
After exiting software standby mode,
normal CPU transmission is possible
by setting TE to 1, reading SSR,
writing TDR, and clearing TDRE to 0,
but note that if the DTC has been
activated, the remaining data in
DTCRAM will be transmitted when
TE and TIE are set to 1.
them to 0 in the same way.
Rev.6.00 Mar. 18, 2009 Page 625 of 980
REJ09B0050-0600

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