DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 1027

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Instruction
MOV.L
ERs,ERd
MOV.L
@ERs,ERd
MOV.L
@(d:16,ERs),
ERd
MOV.L
@(d:32,ERs),
ERd
MOV.L
@ERs+,ERd
MOV.L
@aa:16,ERd
MOV.L
@aa:32,ERd
MOV.L
ERs,@ERd
MOV.L ERs,
@(d:16,ERd)
MOV.L ERs,
@(d:32,ERd)
MOV.L
ERs,@-ERd
MOV.L
ERs,@aa:16
MOV.L
ERs,@aa:32
MOVFPE
@aa:16,Rd
MOVTPE
Rs,@aa:16
MULXS.B
Rs,Rd
MULXS.W
Rs,ERd
1
R:W
NEXT
R:W 2nd R:W
R:W 2nd R:W 3rd R:W
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
R:W 2nd R:W
R:W 2nd R:W 3rd R:W
R:W 2nd R:W 3rd R:W 4th R:W
R:W 2nd R:W
R:W 2nd R:W 3rd R:W
R:W 2nd R:W 3rd R:W 4th R:W 5th R:W
R:W 2nd R:W
R:W 2nd R:W 3rd R:W
R:W 2nd R:W 3rd R:W 4th R:W
Not available in this LSI.
R:W 2nd R:W
R:W 2nd R:W
2
NEXT
NEXT
NEXT
NEXT
NEXT
NEXT
3
R:W:M
EA
NEXT
1 state of
internal
operation
NEXT
W:W:M
EA
NEXT
1 state of
internal
operation
NEXT
2 status of internal
operation
3 status of internal operation
4
R:W
EA+2
R:W:M
EA
R:W:M
EA
R:W:M
EA
NEXT
W:W
EA+2
W:W:M
EA
W:W:M
EA
W:W:M
EA
NEXT
5
R:W
EA+2
NEXT
R:W
EA+2
R:W
EA+2
R:W:M
EA
W:W
EA+2
NEXT
W:W
EA+2
W:W
EA+2
W:W:M
EA
Rev.6.00 Mar. 18, 2009 Page 967 of 980
6
R:W:M
EA
R:W
EA+2
W:W:M
EA
W:W
EA+2
7
R:W
EA+2
W:W
EA+2
REJ09B0050-0600
8
Appendix
9