DF2367VF33 Renesas Electronics America, DF2367VF33 Datasheet - Page 1010

• Manufacturer Part Number: DF2367VF33
• Description: MCU 3V 384K 128-QFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2300r

Specifications of DF2367VF33

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 33MHz
• Connectivity: I²C, IrDA, SCI, SmartCard
• Peripherals: DMA, POR, PWM, WDT
• Number Of I /o: 84
• Program Memory Size: 384KB (384K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b, D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 128-QFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Other names: HD64F2367VF33; HD64F2367VF33

Appendix
C.
The package dimension that is shown in the Renesas Semiconductor Package Data Book has
Priority.
Rev.6.00 Mar. 18, 2009 Page 950 of 980
REJ09B0050-0600
120
91
P-TQFP120-14x14-0.40
JEITA Package Code
e
90
Package Dimensions
1
Z
D
Index mark
*1
3
H
D
D
RENESAS Code
PTQP0120LA-A
y
Figure C.1 Package Dimensions (TFP-120)
*3
b
p
61
0
TFP-120/TFP-120V
Previous Code
x
60
31
M
F
MASS[Typ.]
0.5g
Terminal cross section
Detail F
b
b
1
p
NOTE)
1. DIMENSIONS"*1"AND"*2"
2. DIMENSION"*3"DOES NOT
DO NOT INCLUDE MOLD FLASH
INCLUDE TRIM OFFSET.
L
1
L
θ
Reference
Symbol
D
E
A
H
H
A
A
b
b
c
c
e
x
y
Z
Z
L
L
θ
p
1
1
1
2
D
E
1
D
E
15.8
15.8
0.00
0.12
0.12
Min
0.4
0 °
Dimension in Millimeters
Nom
1.00
16.0
16.0
0.10
0.17
0.15
0.17
0.15
1.20
1.20
0.4
14
14
0.5
1.0
Max
16.2
16.2
1.20
0.20
0.22
0.22
0.07
0.10
0.6
8 °