DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 691

IC H8S/2266 MCU FLASH 100-TQFP

DF2266TF13V

Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2266TF13V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
25.4.3
Figures 25.7 to 25.12 show timing of on-chip peripheral modules.
TCLKA to TCLKC,
TCLKD*
Note: * Supported only by the H8S/2268 Group.
TMCI01,
TMCI23*,
TMCI4*
Note: * Supported only by the H8S/2268 Group.
Timing of On-Chip Peripheral Modules
NMI
IRQ
SCK0 to SCK2
Figure 25.8 8-Bit Timer Clock Input Timing
Figure 25.9 SCK Clock Input Timing
Figure 25.7 TPU Clock Input Timing
Figure 25.6 Interrupt Input Timing
t
TMCWL
t
TCKWL
t
SCKW
t
t
NMIW
IRQW
Rev. 5.00 Sep. 01, 2009 Page 639 of 656
t
SCKr
t
Scyc
Section 25 Electrical Characteristics
t
SCKf
t
TMCWH
t
TCKWH
REJ09B0071-0500

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