DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 486
![IC H8S/2266 MCU FLASH 100-TQFP](/photos/12/29/122926/df2266tf13v_sml.jpg)
DF2266TF13V
Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2266TF20V.pdf
(712 pages)
Specifications of DF2266TF13V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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Section 14 I
8. Notes on Start Condition Issuance for Retransmission
Rev. 5.00 Sep. 01, 2009 Page 434 of 656
REJ09B0071-0500
Depending on the timing combination with the start condition issuance and the subsequently
writing data to ICDR, it may not be possible to issue the retransmission and the data
transmission after retransmission condition issuance.
After start condition issuance is done and determined the start condition, write the transmit
data to ICDR, as shown below. Figure 14.22 shows the timing of start condition issuance for
retransmission, and the timing for subsequently writing data to ICDR, together with the
corresponding flowchart.
2
C Bus Interface (IIC) (Supported as an Option by H8S/2264 Group)
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