DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 544

• Manufacturer Part Number: DF2266TF13V
• Description: IC H8S/2266 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2266TF13V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 17 LCD Controller/Driver
17.4.6
When a large panel is driven, the on-chip power supply capacity may be insufficient. In this case,
the power supply impedance must be reduced. This can be done by connecting bypass capacitors
of around 0.1 to 0.3 µF to pins V1 to V3, as shown in figure 17.12, or by adding a split-resistance
externally.
Rev. 5.00 Sep. 01, 2009 Page 492 of 656
REJ09B0071-0500
Boosting the LCD Drive Power Supply
This LSI
V
V
CC
SS
Figure 17.12 Connection of External Split-Resistance
V1
V2
V3
VR
R
R
R
R =
several kΩ to
several MΩ
C = 0.1 to 0.3 μF