DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 6

• Manufacturer Part Number: DF2266TF13V
• Description: IC H8S/2266 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2266TF13V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

This manual comprises the following items:
1. General Precautions in the Handling of MPU/MCU Products
2. Configuration of This Manual
3. Preface
4. Main Revisions for This Edition
5. Contents
6. Overview
7. Description of Functional Modules
When designing an application system that includes this LSI, take notes into account. Each section
includes notes in relation to the descriptions given, and usage notes are given, as required, as the
final part of each section.
8. List of Registers
9. Electrical Characteristics
10. Appendix
11. Index
Rev. 5.00 Sep. 01, 2009 Page iv of l
REJ09B0071-0500
The list of revisions is a summary of points that have been revised or added to earlier versions.
This does not include all of the revised contents. For details, see the actual locations in this
manual.
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•
The configuration of the functional description of each module differs according to the
module. However, the generic style includes the following items:
i) Feature
ii) Input/Output Pin
iii) Register Description
iv) Operation
v) Usage Note
CPU and System-Control Modules
On-Chip Peripheral Modules
Configuration of This Manual