DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 563
DF2266TF13V
Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet
1.DF2266TF20V.pdf
(712 pages)
Specifications of DF2266TF13V
Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
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20.4
The flash memory is controlled by means of the pins shown in table 20.2.
Table 20.2 Pin Configuration
20.5
The flash memory has the following registers.
• Flash memory control register 1 (FLMCR1)
• Flash memory control register 2 (FLMCR2)
• Erase block register 1 (EBR1)
• Erase block register 2 (EBR2)
• RAM emulation register (RAMER)
• Flash memory power control register (FLPWCR)
• Serial control register X (SCRX)
The registers described above are not present in the masked ROM version. If a register described
above is read in the masked ROM version, an undefined value will be returned.
Pin Name
RES
FWE
MD2
MD1
P70
P16
P14
TxD0
RxD0
Register Descriptions
Input/Output Pins
I/O
Input
Input
Input
Input
Input
Input
Input
Output
Input
Function
Reset
Flash program/erase protection by hardware
Sets this LSI’s operating mode
Sets this LSI’s operating mode
Sets MCU operating mode in programmer mode
Sets MCU operating mode in programmer mode
Sets MCU operating mode in programmer mode
Serial transmit data output
Serial receive data input
Rev. 5.00 Sep. 01, 2009 Page 511 of 656
REJ09B0071-0500
Section 20 ROM
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