DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 393

IC H8S/2266 MCU FLASH 100-TQFP

DF2266TF13V

Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2266TF13V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
13.4.3
Either an internal clock generated by the on-chip baud rate generator or an external clock input at
the SCK pin can be selected as the SCI’s serial clock, according to the setting of the C/A bit in
SMR and the CKE0 and CKE1 bits in SCR. When an external clock is input at the SCK pin, the
clock frequency should be 16 times the bit rate used. When an external clock is selected, a base
clock with an average transfer rate can be selected by setting bits ACS2 to ACS0 in SEMR_0.
When the SCI is operated on an internal clock, the clock can be output from the SCK pin when
setting CKE1 = 0 and CKE0 = 1. The frequency of the clock output in this case is equal to the bit
rate, and the phase is such that the rising edge of the clock is in the middle of the transmit data, as
shown in figure 13.7.
SCK
TxD
Figure 13.7 Relationship between Output Clock and Transfer Data Phase
Clock
0
D0
D1
D2
(Asynchronous Mode)
D3
D4
1 frame
D5
Section 13 Serial Communication Interface (SCI)
D6
Rev. 5.00 Sep. 01, 2009 Page 341 of 656
D7
0/1
1
1
REJ09B0071-0500

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