DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 52

• Manufacturer Part Number: DF2266TF13V
• Description: IC H8S/2266 MCU FLASH 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2200r

Specifications of DF2266TF13V

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 13MHz
• Connectivity: I²C, SCI, SmartCard
• Peripherals: LCD, POR, PWM, WDT
• Number Of I /o: 67
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 5.5 V
• Data Converters: A/D 10x10b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Table 21.4
Section 22 Power-Down Modes
Table 22.1
Table 22.2
Table 22.3
Section 25 Electrical Characteristics
Table 25.1
Table 25.2
Table 25.2
Table 25.2
Table 25.2
Table 25.3
Table 25.4
Table 25.4
Table 25.5
Table 25.6
Table 25.7
Table 25.8
Table 25.9
Table 25.10 D/A Conversion Characteristics ............................................................................. 616
Table 25.11 LCD Characteristics ............................................................................................... 617
Table 25.12 DTMF Characteristics ............................................................................................ 618
Table 25.13 Flash Memory Characteristics................................................................................ 619
Table 25.14 Absolute Maximum Ratings................................................................................... 621
Table 25.15 DC Characteristics (1) ............................................................................................ 622
Table 25.15 DC Characteristics (2) ............................................................................................ 624
Table 25.15 DC Characteristics (3) ............................................................................................ 625
Table 25.15 DC Characteristics (4) ............................................................................................ 627
Table 25.16 Permissible Output Currents .................................................................................. 629
Table 25.17 Bus Drive Characteristics (1) ................................................................................. 630
Table 25.17 Bus Drive Characteristics (2) ................................................................................. 631
Table 25.18 Clock Timing.......................................................................................................... 632
Table 25.19 Control Signal Timing............................................................................................ 633
Table 25.20 Timing of On-Chip Peripheral Modules................................................................. 634
Table 25.21 I
Table 25.22 A/D Conversion Characteristics ............................................................................. 636
Table 25.23 LCD Characteristics ............................................................................................... 637
Rev. 5.00 Sep. 01, 2009 Page l of l
REJ09B0071-0500
External Clock Input Conditions (Duty Adjustment Circuit Not Used)................. 545
LSI Internal States in Each Mode........................................................................... 552
Low Power Dissipation Mode Transition Conditions ............................................ 555
Oscillation Settling Time Settings.......................................................................... 563
Absolute Maximum Ratings................................................................................... 599
DC Characteristics (1) ............................................................................................ 600
DC Characteristics (2) ............................................................................................ 602
DC Characteristics (3) ............................................................................................ 604
DC Characteristics (4) ............................................................................................ 606
Permissible Output Currents .................................................................................. 608
Bus Drive Characteristics (1) ................................................................................. 609
Bus Drive Characteristics (2) ................................................................................. 610
Clock Timing.......................................................................................................... 611
Control Signal Timing............................................................................................ 612
Timing of On-Chip Peripheral Modules................................................................. 613
I
A/D Conversion Characteristics ............................................................................. 615
2
2
C Bus Timing....................................................................................................... 614
C Bus Timing....................................................................................................... 635