DF2266TF13V Renesas Electronics America, DF2266TF13V Datasheet - Page 21

IC H8S/2266 MCU FLASH 100-TQFP

DF2266TF13V

Manufacturer Part Number
DF2266TF13V
Description
IC H8S/2266 MCU FLASH 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2200r
Datasheet

Specifications of DF2266TF13V

Core Processor
H8S/2000
Core Size
16-Bit
Speed
13MHz
Connectivity
I²C, SCI, SmartCard
Peripherals
LCD, POR, PWM, WDT
Number Of I /o
67
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 5.5 V
Data Converters
A/D 10x10b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Item
25.3.4 A/D
Conversion
Characteristics
Table 25.22 A/D
Conversion
Characteristics
Appendix B Product
Codes
Page
636
646 to 649Packages amended
Revision (See Manual for Details)
Table condition amended
Condition B (Masked-ROM version): V
= 2.7 V to 5.5 V * , V
13.5 MHz, T
40°C to +85°C (wide-range specifications)
Condition D (Masked-ROM version): V
= 4.0 V to 5.5 V * , V
20.5 MHz, T
40°C to +85°C (wide-range specifications)
Note added
Note: * AN0 and AN1 can be used only when Vcc = AVcc.
(Before) FP-100B → (After) FP-100B, FP-100BV
(Before) TFP-100B → (After) TFP-100B, TFP-100BV
(Before) TFP-100G → (After) TFP-100G, TFP-100GV
a
a
= –20°C to +75°C (regular specifications), T
= –20°C to +75°C (regular specifications), T
ref
ref
= 2.7 V to AV
= 4.0 V to AV
Rev. 5.00 Sep. 01, 2009 Page xix of l
CC
CC
, V
, V
CC
CC
SS
SS
= 2.7 V to 5.5 V * , AV
= 4.0 V to 5.5 V * , AV
= AV
= AV
REJ09B0071-0500
SS
SS
= 0 V, φ = 2 to
= 0 V, φ = 10 to
a
a
= –
= –
CC
CC

Related parts for DF2266TF13V