S912XEP768J5MAGR Freescale Semiconductor, S912XEP768J5MAGR Datasheet - Page 1209

• Manufacturer Part Number: S912XEP768J5MAGR
• Description: 16-bit Microcontrollers - MCU 16-bit 768K Flash
• Manufacturer: Freescale Semiconductor

Specifications of S912XEP768J5MAGR

• Rohs: yes
• Core: HCS12X
• Processor Series: MC9S12
• Data Bus Width: 16 bit
• Maximum Clock Frequency: 50 MHz
• Program Memory Size: 768 KB
• Data Ram Size: 48 KB
• On-chip Adc: Yes
• Operating Supply Voltage: 3.3 V to 5 V
• Operating Temperature Range: - 40 C to + 125 C
• Package / Case: LQFP-144
• Mounting Style: SMD/SMT

A.1.9
Freescale Semiconductor
1. The values for thermal resistance are achieved by package simulations for the 9S12XEQ512 die.
2. Junction to case thermal resistance was simulated to be equivalent to the measured values using the cold plate technique
3. Thermal characterization parameter Ψ
Num
11a
11b
12a
12b
1a
1b
2a
2b
6a
6b
7a
7b
10
13
14
15
with the cold plate temperature used as the “case” temperature. This basic cold plate measurement technique is described
by MIL-STD 883D, Method 1012.1. This is the correct thermal metric to use to calculate thermal performance when the
package is being used with a heat sink.
case as defined in JESD51-2. Ψ
enviroment.
3
4
5
8
9
C
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
D
Thermal resistance single sided PCB, natural convection
Thermal resistance single sided PCB @ 200 ft/min
Thermal resistance double sided PCB
with 2 internal planes, natural convection
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
Junction to Board LQFP 144
Junction to Case LQFP 144
Junction to Package Top LQFP144
Thermal resistance single sided PCB, natural convection
Thermal resistance single sided PCB @ 200 ft/min
Thermal resistance double sided PCB
with 2 internal planes, natural convection
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
Junction to Board LQFP112
Junction to Case LQFP112
Junction to Package Top LQFP112
Thermal resistance single sided PCB, natural convection
Thermal resistance single sided PCB @ 200 ft/min
Thermal resistance double sided PCB
with 2 internal planes, natural convection
Thermal resistance double sided PCB
with 2 internal planes @ 200 ft/min
Junction to Board QFP 80
Junction to Case QFP 80
Junction to Package Top QFP 80
I/O Characteristics
Table A-6. Thermal Package Characteristics (9S12XEQ512)
JT
is a useful value to use to estimate junction temperature in a steady state customer
MC9S12XE-Family Reference Manual Rev. 1.25
(2)
Rating
2.
JT
2.
is the “resistance” from junction to reference point thermocouple on top center of the
(3)
3
3
LQFP144
LQFP112
QFP80
Symbol
Ψ
Ψ
Ψ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
θ
JC
JC
JC
JA
JA
JA
JA
JB
JA
JA
JA
JA
JB
JA
JA
JA
JA
JB
JT
JT
JT
Min
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Appendix A Electrical Characteristics
(1)
Typ
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Max
49
40
40
34
28
50
40
40
34
28
50
40
37
31
23
13
9
2
9
2
3
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
1209