ISP1561BMUM ST-Ericsson Inc, ISP1561BMUM Datasheet - Page 95

• Manufacturer Part Number: ISP1561BMUM
• Description: IC USB HOST CTRL HI-SPD 128LQFP
• Manufacturer: ST-Ericsson Inc

Specifications of ISP1561BMUM

• Controller Type: USB Peripheral Controller
• Interface: PCI
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 128-LQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Supply: -
• Other names: ISP1561BM-T; ISP1561BM-T

NXP Semiconductors
ISP1561_2
Product data sheet
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 136. SnPb eutectic process (from J-STD-020C)
Table 137. Lead-free process (from J-STD-020C)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 136
and
Figure
137
10.
Rev. 02 — 5 March 2007
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
10) than a PbSn process, thus
220
220
HS USB PCI Host Controller
350
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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