DF2110BVTE10 Renesas Electronics America, DF2110BVTE10 Datasheet - Page 69

MCU 3V 64K 100-TQFP

DF2110BVTE10

Manufacturer Part Number
DF2110BVTE10
Description
MCU 3V 64K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2110BVTE10

Core Processor
H8S/2000
Core Size
16-Bit
Speed
10MHz
Connectivity
Host Interface (LPC), I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
82
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2110BVTE10
HD64F2110BVTE10

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2110BVTE10V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Table 2.3
Instruction
MOV
MOVFPE
MOVTPE
POP
PUSH
LDM *
STM *
Notes: 1. Size refers to the operand size.
2
2
2. ER7 is not used as the register that can be saved (STM)/restored (LDM) when using
B: Byte
W: Word
L: Longword
STM/LDM instruction, because ER7 is the stack pointer.
Data Transfer Instructions
Size *
B/W/L
B
B
W/L
W/L
L
L
1
Function
(EAs)
Moves data between two general registers or between a general register
and memory, or moves immediate data to a general register.
Pops a general register from the stack. POP.W Rn is identical to MOV.W
@SP+, Rn. POP.L ERn is identical to MOV.L @SP+, ERn
Pushes a general register onto the stack. PUSH.W Rn is identical to
MOV.W Rn, @-SP. PUSH.L ERn is identical to MOV.L ERn, @-SP.
@SP+
Pops two or more general registers from the stack.
Rn (register list)
Pushes two or more general registers onto the stack.
Cannot be used in this LSI.
Cannot be used in this LSI.
@SP+
Rn
@-SP
Rd, Rs
Rn
Rn (register list)
@-SP
(EAd)
Rev. 2.00 Mar 21, 2006 page 29 of 518
REJ09B0299-0200
Section 2 CPU

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