DF2110BVTE10 Renesas Electronics America, DF2110BVTE10 Datasheet - Page 404

MCU 3V 64K 100-TQFP

DF2110BVTE10

Manufacturer Part Number
DF2110BVTE10
Description
MCU 3V 64K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2110BVTE10

Core Processor
H8S/2000
Core Size
16-Bit
Speed
10MHz
Connectivity
Host Interface (LPC), I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
82
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2110BVTE10
HD64F2110BVTE10

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2110BVTE10V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 15 Host Interface LPC Interface (LPC)
Bit
0
Legend:
X: Don't care
Rev. 2.00 Mar 21, 2006 page 364 of 518
REJ09B0299-0200
Bit Name Initial Value Slave Host Description
LSCIE
0
R/W
R/W
LSCI output Enable
Controls LSCI output in combination with the LSCIB
bit in HICR1. LSCI pin output is open-drain, and an
external pull-up resistor is needed to pull the output
up to V
When the LSCI output function is used, the DDR bit
for PB1 must not be set to 1.
LSCIE
0
1
1
CC
LSCIB
x: LSCI output disabled, other function of
0: LSCI output enabled, LSCI pin output
1: LSCI output enabled, LSCI pin output is
high-impedance
pin is enabled
goes to 0 level

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