DF2110BVTE10 Renesas Electronics America, DF2110BVTE10 Datasheet - Page 474

MCU 3V 64K 100-TQFP

DF2110BVTE10

Manufacturer Part Number
DF2110BVTE10
Description
MCU 3V 64K 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8S/2100r
Datasheet

Specifications of DF2110BVTE10

Core Processor
H8S/2000
Core Size
16-Bit
Speed
10MHz
Connectivity
Host Interface (LPC), I²C, SCI
Peripherals
POR, PWM, WDT
Number Of I /o
82
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Ram Size
2K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Oscillator Type
External
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Eeprom Size
-
Data Converters
-
Other names
HD64F2110BVTE10
HD64F2110BVTE10

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF2110BVTE10V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 18 Clock Pulse Generator
18.1
Clock pulses can be supplied either by connecting a crystal resonator, or by providing external
clock input.
18.1.1
Figure 18.2 shows a typical method of connecting a crystal resonator. An appropriate damping
resistance R
should be used.
Figure 18.3 shows the equivalent circuit of a crystal resonator. A resonator having the
characteristics given in table 18.2 should be used.
A crystal resonator with frequency identical to that of the system clock ( ) should be used.
Table 18.1 Damping Resistance Values
Frequency (MHz)
R
Rev. 2.00 Mar 21, 2006 page 434 of 518
REJ09B0299-0200
d
( )
Oscillator
Connecting Crystal Resonator
d
, given in table 18.1, should be used. An AT-cut parallel-resonance crystal resonator
XTAL
Figure 18.2 Typical Connection to Crystal Resonator
Figure 18.3 Equivalent Circuit of Crystal Resonator
2
1 k
EXTAL
XTAL
L
R
d
C
C
L
0
4
500
C
C
AT-cut parallel-resonance crystal resonator
L1
L2
R
s
EXTAL
C
L1
8
200
= C
L2
= 10 to 22 pF
10
0

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