DF2110BVTE10 Renesas Electronics America, DF2110BVTE10 Datasheet - Page 28

• Manufacturer Part Number: DF2110BVTE10
• Description: MCU 3V 64K 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8S/2100r

Specifications of DF2110BVTE10

• Core Processor: H8S/2000
• Core Size: 16-Bit
• Speed: 10MHz
• Connectivity: Host Interface (LPC), I²C, SCI
• Peripherals: POR, PWM, WDT
• Number Of I /o: 82
• Program Memory Size: 64KB (64K x 8)
• Program Memory Type: FLASH
• Ram Size: 2K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Oscillator Type: External
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Eeprom Size: -
• Data Converters: -
• Other names: HD64F2110BVTE10; HD64F2110BVTE10

19.3 Medium-Speed Mode........................................................................................................ 449
19.4 Sleep Mode ....................................................................................................................... 450
19.5 Software Standby Mode.................................................................................................... 451
19.6 Hardware Standby Mode .................................................................................................. 452
19.7 Watch Mode...................................................................................................................... 453
19.8 Subsleep Mode.................................................................................................................. 454
19.9 Subactive Mode ................................................................................................................ 455
19.10 Module Stop Mode ........................................................................................................... 456
19.11 Direct Transitions.............................................................................................................. 456
19.12 Usage Notes ...................................................................................................................... 457
Section 20 List of Registers
20.1 Register Addresses (Address Order) ................................................................................. 460
20.2 Register Bits...................................................................................................................... 467
20.3 Register States in Each Operating Mode........................................................................... 473
20.4 Register Select Conditions ................................................................................................ 479
Section 21 Electrical Characteristics
21.1 Electrical Characteristics................................................................................................... 487
21.2 Timing Chart..................................................................................................................... 501
Appendix A I/O Port States in Each Processing State
Appendix B Product Codes
Appendix C Package Dimensions
Index
Rev. 2.00 Mar 21, 2006 page xxvi of xxxviii
19.12.1 I/O Port Status...................................................................................................... 457
19.12.2 Current Consumption when Waiting for Oscillation Stabilization ...................... 457
21.1.1 Absolute Maximum Ratings ................................................................................ 487
21.1.2 DC Characteristics ............................................................................................... 488
21.1.3 AC Characteristics ............................................................................................... 494
21.1.4 Flash Memory Characteristics ............................................................................. 499
21.1.5 Usage Note........................................................................................................... 501
21.2.1 Clock Timing ....................................................................................................... 501
21.2.2 Control Signal Timing ......................................................................................... 503
21.2.3 On-Chip Peripheral Module Timing .................................................................... 504
............................................................................................................................. 515
.............................................................................................. 459
.............................................................................................. 512
................................................................................... 513
.............................................................................. 487
.............................................. 511