DF61657CN35FTV Renesas Electronics America, DF61657CN35FTV Datasheet - Page 64

• Manufacturer Part Number: DF61657CN35FTV
• Description: IC H8SX/1657 MCU FLASH 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of DF61657CN35FTV

• Core Processor: H8SX
• Core Size: 32-Bit
• Speed: 35MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 82
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• For Use With: 3DK1657 - DEV EVAL KIT FOR H8SX/1657
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 2 CPU
[Legend]
d:
S:
D:
SD:
S/D:
S:4:
Notes: 1. Only @aa:16 is available.
Rev. 2.00 Jun. 28, 2007 Page 38 of 864
REJ09B0341-0200
Classifi-
cation
Bit
manipu-
lation
Branch
System
control
d:16 or d:32
Can be specified as a source operand.
Can be specified as a destination operand.
Can be specified as either a source or destination operand or both.
Can be specified as either a source or destination operand.
4-bit immediate data can be specified as a source operand.
2. @ERn+ as a source operand and @−ERn as a destination operand
3. Specified by ER5 as a source address and ER6 as a destination address for data
Instruction
BSET, BCLR,
BNOT, BTST,
BSET/cc,
BCLR/cc
BAND, BIAND,
BOR, BIOR,
BXOR,
BIXOR, BLD,
BILD, BST,
BIST, BSTZ,
BISTZ
BFLD
BFST
BRA/BS,
BRA/BC*
BSR/BS,
BSR/BC*
LDC
(CCR, EXR)
LDC
(VBR, SBR)
STC
(CCR, EXR)
STC
(VBR, SBR)
ANDC, ORC,
XORC
SLEEP
NOP
transfer.
8
8
Size
B
B
B
B
B
B
B/W*
L
B/W*
L
B


9
9
#xx
S
S
Rn
D
D
D
S
S
S
D
D
@ERn
D
D
S
D
S
S
S
D
@(d,ERn)
S
D
Addressing Mode
@(d,
RnL.B/
Rn.W/
ERn.L)
@−ERn/
@ERn+/
@ERn−/
@+ERn
S*
D*
10
11
@aa:8
D
D
S
D
S
S
@aa:16/
@aa:32
D
D
S
D
S
S
S
D

O
O