DF61657CN35FTV Renesas Electronics America, DF61657CN35FTV Datasheet - Page 24

• Manufacturer Part Number: DF61657CN35FTV
• Description: IC H8SX/1657 MCU FLASH 120TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8SX/1600r

Specifications of DF61657CN35FTV

• Core Processor: H8SX
• Core Size: 32-Bit
• Speed: 35MHz
• Connectivity: SCI, SmartCard
• Peripherals: DMA, PWM, WDT
• Number Of I /o: 82
• Program Memory Size: 768KB (768K x 8)
• Program Memory Type: FLASH
• Ram Size: 24K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 120-TQFP, 120-VQFP
• For Use With: 3DK1657 - DEV EVAL KIT FOR H8SX/1657
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

16.3 Register Descriptions......................................................................................................... 644
16.4 Operation ........................................................................................................................... 647
16.5 Usage Notes ....................................................................................................................... 648
Section 17 RAM ................................................................................................ 649
Section 18 Flash Memory (0.18-µm F-ZTAT Version).................................... 651
18.1 Features.............................................................................................................................. 651
18.2 Mode Transition Diagram.................................................................................................. 653
18.3 Memory MAT Configuration ............................................................................................ 655
18.4 Block Structure .................................................................................................................. 656
18.5 Programming/Erasing Interface ......................................................................................... 658
18.6 Input/Output Pins............................................................................................................... 660
18.7 Register Descriptions......................................................................................................... 660
18.8 On-Board Programming Mode .......................................................................................... 681
18.9 Protection........................................................................................................................... 706
18.10 Flash Memory Emulation Using RAM.............................................................................. 709
18.11 Switching between User MAT and User Boot MAT......................................................... 712
18.12 Programmer Mode ............................................................................................................. 713
18.13 Standard Serial Communication Interface Specifications for Boot Mode ......................... 713
18.14 Usage Notes ....................................................................................................................... 742
Section 19 Clock Pulse Generator..................................................................... 745
19.1 Register Description .......................................................................................................... 746
Rev. 2.00 Jun. 28, 2007 Page xxii of xxiv
16.3.1 D/A Data Registers 0 and 1 (DADR0 and DADR1)............................................. 644
16.3.2 D/A Control Register 01 (DACR01) .................................................................... 645
16.5.1 Module Stop State Setting .................................................................................... 648
16.5.2 D/A Output Hold Function in Software Standby Mode........................................ 648
18.4.1 Block Diagram of H8SX/1657C........................................................................... 656
18.4.2 Block Diagram of H8SX/1656C........................................................................... 657
18.7.1 Programming/Erasing Interface Registers ............................................................ 661
18.7.2 Programming/Erasing Interface Parameters ......................................................... 668
18.7.3 RAM Emulation Register (RAMER).................................................................... 680
18.8.1 Boot Mode ............................................................................................................ 681
18.8.2 User Program Mode.............................................................................................. 685
18.8.3 User Boot Mode.................................................................................................... 696
18.8.4 On-Chip Program and Storable Area for Program Data ....................................... 700
18.9.1 Hardware Protection ............................................................................................. 706
18.9.2 Software Protection .............................................................................................. 707
18.9.3 Error Protection .................................................................................................... 707