MT46V32M4TG-6T:D TR Micron Technology Inc, MT46V32M4TG-6T:D TR Datasheet - Page 93

• Manufacturer Part Number: MT46V32M4TG-6T:D TR
• Description: IC DDR SDRAM 128MBIT 6NS 66TSOP
• Manufacturer: Micron Technology Inc

Specifications of MT46V32M4TG-6T:D TR

• Format - Memory: RAM
• Memory Type: DDR SDRAM
• Memory Size: 128M (32Mx4)
• Speed: 6ns
• Interface: Parallel
• Voltage - Supply: 2.3 V ~ 2.7 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 66-TSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: 557-1024-2

Figure 55:
09005aef8074a655
128MBDDRx4x8x16_2.fm - Rev. J 4/05 EN
PRE-REFLOW DIAMETER IS Ø 0.40mm.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
SOLDER BALL DIAMETER REFERS TO
POST REFLOW CONDITION. THE
for production devices. Although considered final, these specifications are subject to change, as further product
SEATING PLANE
60-Ball FBGA (16 x 9mm)
0.10 C
11.00
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc.
60X Ø
[e-mail] www.micron.com Customer Comment Line: 800-932-4992
BALL A9
5.50 ±0.05
Note:
.45
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: [phone]
0.850 ±0.075
All other trademarks are the property of their respective owners.
C
3.20 ±0.05 4.50 ±0.05
All dimensions are in millimeters.
development and data characterization sometimes occur.
9.00 ±0.10
0.80
TYP
6.40
C L
C L
BALL A1
1.00
TYP
BALL A1 ID
8.00 ±0.05
93
16.00 ±0.10
®
Micron Technology, Inc., reserves the right to change products or specifications without notice.
1.20 MAX
128Mb: x4, x8, x16 DDR SDRAM
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2% Ag
SOLDER BALL PAD: Ø .33mm
SUBSTRATE: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
BALL #1 ID
Package Dimensions
©2000 Micron Technology, Inc. All rights reserved.