DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 787
![MCU 3V 256K PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 787 of 843
- Download datasheet (5Mb)
BRR—Bit Rate Register
SCR—Serial Control Register
TDR—Transmit Data Register
Note: Bit functions are the same as for SCI0.
SSR—Serial Status Register
Notes: Bit functions are the same as for SCI0.
Initial value
Read/Write
Initial value
Read/Write
Initial value
Read/Write
Initial value
Read/Write
Note: Bit functions are the same as for SCI0.
Note: Bit functions are the same as for SCI0.
* Only 0 can be written to clear the flag.
Bit
Bit
Bit
Bit
R/W
R/W
TIE
R/(W) *
TDRE
7
1
7
0
R/W
7
1
7
0
R/W
R/W
RIE
R/(W) *
RDRF
6
1
6
0
R/W
6
1
6
0
R/W
R/W
R/(W) *
ORER
TE
5
1
5
0
R/W
5
1
5
0
FER/ERS
R/(W) *
R/W
R/W
RE
R/W
4
1
4
0
4
1
4
0
H'FFFB9
H'FFFBA
H'FFFBB
H'FFFBC
Rev. 2.00 Sep 20, 2005 page 747 of 800
MPIE
R/(W) *
R/W
R/W
PER
R/W
3
1
3
0
3
1
3
0
Appendix B Internal I/O Registers
TEIE
TEND
R/W
R/W
R/W
2
1
2
0
R
2
1
2
1
REJ09B0260-0200
CKE1
R/W
R/W
MPB
R/W
1
1
1
0
R
1
1
1
0
MPBT
CKE0
R/W
R/W
R/W
R/W
0
1
0
0
0
1
0
0
SCI1
SCI1
SCI1
SCI1
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