DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 509
![MCU 3V 256K PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 509 of 843
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An example of D/A conversion on channel 0 is given next. Timing is indicated in figure 15.2.
1. Data to be converted is written in DADR0.
2. Bit DAOE0 is set to 1 in DACR. D/A conversion starts and DA
3. If the DADR0 value is modified, conversion starts immediately, and the result is output after
4. When the DAOE0 bit is cleared to 0, DA0 becomes an input pin.
Address
DADR0
DAOE0
DA
Legend:
t
DCONV
converted result is output after the conversion time.
The output value is
Output of this conversion result continues until the value in DADR0 is modified or the
DAOE0 bit is cleared to 0.
the conversion time.
0
: D/A conversion time
DADR0
write cycle
High-impedance state
Figure 15.2 Example of D/A Converter Operation
DADR contents
DACR
write cycle
256
Conversion data 1
t
DCONV
V
REF
Conversion
result 1
Rev. 2.00 Sep 20, 2005 page 469 of 800
DADR0
write cycle
0
becomes an output pin. The
t
DCONV
Section 15 D/A Converter
Conversion data 2
REJ09B0260-0200
Conversion
result 2
DACR
write cycle
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