DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 581
![MCU 3V 256K PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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18.4
18.4.1
When the mode pins and the FWE pin are set in the reset state and a reset-start is executed, the
H8/3024F-ZTAT version enters one of the operating modes shown in figure 18.3. In user mode,
flash memory can be read but not programmed or erased.
Flash memory can be programmed and erased in boot mode, user program mode, and PROM
mode.
Boot mode and user program mode cannot be used in the H8/3024F-ZTAT version’s mode 6
(normal mode with on-chip ROM enabled).
ROM blocks
EB0–EB3
(H'000000–
H'000FFF)
Overview of Operation
Mode Transitions
H'0003FF
H'0007FF
H'000BFF
H'000C00
H'000FFF
H'000000
H'000400
H'000800
Figure 18.2 Example of ROM Area/RAM Area Overlap
Mapping RAM
ROM area
EB0
EB1
EB2
EB3
ROM selection
area
RAM selection
area
Section 18 Flash Memory [H8/3024F-ZTAT Version]
Rev. 2.00 Sep 20, 2005 page 541 of 800
Actual RAM
RAM area
H'FFEFFF
H'FFEF20
H'FFF3FF
H'FFFF1F
H'FFF000
H'FFF400
REJ09B0260-0200
RAM
overlap area
(H'FFF000–
H'FFF3FF)
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