DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 556

MCU 3V 256K PB-FREE 100-TQFP

DF3026X25V

Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Datasheets

Specifications of DF3026X25V

Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
Section 17 Flash Memory [H8/3026F-ZTAT Version]
Rev. 2.00 Sep 20, 2005 page 516 of 800
REJ09B0260-0200
H'3FFFF
H'00000
H'01000
H'02000
H'03000
H'04000
H'05000
H'06000
H'07000
H'08000
Figure 17.14 Example of RAM Overlap Operation
Flash memory
EB8 to EB11
EB0
EB1
EB2
EB3
EB4
EB5
EB6
EB7
This area can be accessed
from both the RAM area
and flash memory area
On-chip RAM
H'FFE000
H'FFEFFF
H'FFFF1F

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