DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 464

• Manufacturer Part Number: DF3026X25V
• Description: MCU 3V 256K PB-FREE 100-TQFP
• Manufacturer: Renesas Electronics America
• Series: H8® H8/300Hr

Specifications of DF3026X25V

• Core Processor: H8/300H
• Core Size: 16-Bit
• Speed: 25MHz
• Connectivity: SCI, SmartCard
• Peripherals: PWM, WDT
• Number Of I /o: 70
• Program Memory Size: 256KB (256K x 8)
• Program Memory Type: FLASH
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 8x10b; D/A 2x8b
• Oscillator Type: Internal
• Operating Temperature: -20°C ~ 75°C
• Package / Case: 100-TQFP, 100-VQFP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -

Section 13 Smart Card Interface
Note: Setting both TE and RE to 1 without connecting a smart card enables closed
13.3.3
Figure 13.3 shows the smart card interface data format. In reception in this mode, a parity check is
carried out on each frame, and if an error is detected an error signal is sent back to the transmitting
device to request retransmission of the data. In transmission, the error signal is sampled and the
same data is retransmitted.
Rev. 2.00 Sep 20, 2005 page 424 of 800
REJ09B0260-0200
transmission/reception, allowing self-diagnosis to be carried out.
Data Format
Card-processing device
H8/3024 Group
Figure 13.2 Smart Card Interface Connection Diagram
chip
TxD
RxD
SCK
Px (port)
Data line
Clock line
Reset line
V
CC
I/O
CLK
RST
Smart card