DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 464
![MCU 3V 256K PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 13 Smart Card Interface
Note: Setting both TE and RE to 1 without connecting a smart card enables closed
13.3.3
Figure 13.3 shows the smart card interface data format. In reception in this mode, a parity check is
carried out on each frame, and if an error is detected an error signal is sent back to the transmitting
device to request retransmission of the data. In transmission, the error signal is sampled and the
same data is retransmitted.
Rev. 2.00 Sep 20, 2005 page 424 of 800
REJ09B0260-0200
transmission/reception, allowing self-diagnosis to be carried out.
Data Format
Card-processing device
H8/3024 Group
Figure 13.2 Smart Card Interface Connection Diagram
chip
TxD
RxD
SCK
Px (port)
Data line
Clock line
Reset line
V
CC
I/O
CLK
RST
Smart card
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