DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 67
![MCU 3V 256K PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
- Current page: 67 of 843
- Download datasheet (5Mb)
2.5.2
Figure 2.8 shows the data formats on memory. The H8/300H CPU can access word data and
longword data on memory, but word or longword data must begin at an even address. If an attempt
is made to access word or longword data at an odd address, no address error occurs but the least
significant bit of the address is regarded as 0, so the access starts at the preceding address. This
also applies to instruction fetches.
Data Type
Word data
Word data
Longword data
Legend:
ERn:
En:
Rn:
MSB:
LSB:
General register
General register E
General register R
Most significant bit
Least significant bit
Memory Data Formats
General
Register
Rn
En
ERn
Figure 2.7 General Register Data Formats
MSB
MSB
15
31
Data Format
Rev. 2.00 Sep 20, 2005 page 27 of 800
LSB
16
0
MSB
15
15
REJ09B0260-0200
Section 2 CPU
LSB
LSB
0
0
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