DF3026X25V Renesas Electronics America, DF3026X25V Datasheet - Page 624
![MCU 3V 256K PB-FREE 100-TQFP](/photos/28/61/286123/100-tqfp__100-vqfp_sml.jpg)
DF3026X25V
Manufacturer Part Number
DF3026X25V
Description
MCU 3V 256K PB-FREE 100-TQFP
Manufacturer
Renesas Electronics America
Series
H8® H8/300Hr
Specifications of DF3026X25V
Core Processor
H8/300H
Core Size
16-Bit
Speed
25MHz
Connectivity
SCI, SmartCard
Peripherals
PWM, WDT
Number Of I /o
70
Program Memory Size
256KB (256K x 8)
Program Memory Type
FLASH
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
3 V ~ 3.6 V
Data Converters
A/D 8x10b; D/A 2x8b
Oscillator Type
Internal
Operating Temperature
-20°C ~ 75°C
Package / Case
100-TQFP, 100-VQFP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Eeprom Size
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
DF3026X25V
Manufacturer:
Renesas Electronics America
Quantity:
10 000
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Section 19 Clock Pulse Generator
Crystal Resonator: Figure 19.3 shows an equivalent circuit of the crystal resonator. The crystal
resonator should have the characteristics listed in table 19.2.
Table 19.2 Crystal Resonator Parameters
Use a crystal resonator with a frequency equal to the system clock frequency ( ).
Notes on Board Design: When a crystal resonator is connected, the following points should be
noted:
Other signal lines should be routed away from the oscillator circuit to prevent induction from
interfering with correct oscillation. See figure 19.4.
When the board is designed, the crystal resonator and its load capacitors should be placed as close
as possible to the XTAL and EXTAL pins.
Rev. 2.00 Sep 20, 2005 page 584 of 800
REJ09B0260-0200
Frequency (MHz)
Rs max ( )
Co (pF)
XTAL
Figure 19.4 Oscillator Circuit Block Board Design Precautions
Avoid
C
C
Figure 19.3 Crystal Resonator Equivalent Circuit
L2
L1
2
500
L
4
120
Signal A
8
80
C
L
10
70
Signal B
C
0
7 pF max
12
60
AT-cut parallel-resonance type
Rs
XTAL
EXTAL
16
50
H8/3024 Group
18
40
20
40
EXTAL
25
40
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